Where Our Chemicals Work
Our high-purity chemicals are formulated for the most demanding steps across the semiconductor and advanced electronics manufacturing value chain.
Application 01
Semiconductor Wafer Fabrication
Front-end and back-end wafer fabrication processes demand the highest chemical purity available. Our chemicals support critical cleaning, planarization, and surface preparation steps where contamination directly impacts yield.
- CMP Slurry — Oxide & ILD planarization
- IPA — Post-CMP wafer rinse & clean
- H₂O₂ — RCA SC-1/SC-2 cleaning baths
- Inter-Layer Dielectric (ILD) CMP
- Pre-diffusion surface clean
- Post-etch particle removal
- Pre-deposition wafer preparation
Application 02
Advanced Packaging & OSAT
Advanced packaging technologies — including flip-chip, wafer-level packaging, and 2.5D/3D integration — require high-purity chemicals for substrate cleaning, oxide removal, and surface activation steps that are critical to interconnect reliability.
- IPA — Substrate cleaning & preparation
- H₂O₂ — Surface oxide removal & activation
- CMP Slurry — Redistribution layer planarization
- Substrate surface cleaning
- Bond pad preparation
- Through-silicon via (TSV) processing
- Under-bump metallisation prep
Application 03
Semiconductor Wafer Fabrication
Front-end and back-end wafer fabrication processes demand the highest chemical purity available. Our chemicals support critical cleaning, planarization, and surface preparation steps where contamination directly impacts yield.
- CMP Slurry — Oxide & ILD planarization
- IPA — Post-CMP wafer rinse & clean
- H₂O₂ — RCA SC-1/SC-2 cleaning baths
- Inter-Layer Dielectric (ILD) CMP
- Pre-diffusion surface clean
- Post-etch particle removal
- Pre-deposition wafer preparation