Product Portfolio
Three Chemicals.
One Critical Purpose.
Each product is engineered to semiconductor-grade specifications, meeting or targeting SEMI international standards. Formulated for the specific demands of modern wafer fabrication and advanced packaging processes.
Our flagship product. CMP slurry enables the precise planarization of wafer surfaces — a non-negotiable process step in multi-layer semiconductor fabrication. Our back-end oxide CMP slurry is formulated to deliver consistent, controlled removal rates with superior surface finish and minimal defect levels.
Ultra-high-purity IPA is the primary solvent for semiconductor wafer cleaning, post-CMP rinsing, and surface preparation. Our IPA is formulated to meet and exceed SEMI C7 specifications, ensuring minimal metallic and particulate contamination that could compromise device yield.
Phase 1
EG Grade
Advanced
Semiconductor-grade hydrogen peroxide is indispensable in RCA wet cleaning sequences (SC-1 and SC-2 baths), controlled oxidation steps, and advanced wet etching processes. Our H₂O₂ delivers exceptional chemical stability, ultra-low metallic contamination, and controlled decomposition kinetics.